? semiconductor components industries, llc, 2012 january, 2012 ? rev. 7 1 publication order number: msrd620ct/d msrd620ctg, msrd620ctt4g, SSRD8620CTT4G switchmode soft ultrafast recovery power rectifier plastic dpak package state ? of ? the ? art geometry features epitaxial construction with glass passivation and metal overlay contact. ideally suited for low voltage, high frequency switching power supplies, free wheeling diode and polarity protection diodes. features ? soft ultrafast recovery (35 ns typ) ? highly stable oxide passivated junction ? matched dual die construction ? may be paralleled for high current output ? short heat sink tab manufactured ? not sheared ? epoxy meets ul 94 v ? 0 @ 0.125 in. ? aec ? q101 qualified and ppap capable ? ssrd8 prefix for automotive and other applications requiring unique site and control change requirements ? these devices are pb ? free and are rohs compliant* mechanical characteristics ? case: epoxy, molded ? weight: 0.4 grams (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 ? c max. for 10 seconds ? esd ratings: ? machine model = c ? human body model = 2 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soft ultrafast rectifier 6.0 amperes, 200 volts 1 3 2, 4 dpak case 369c marking diagram a = assembly location y = year ww = work week g = pb ? free package ayww s 620tg device package shipping ? ordering information msrd620ctt4g dpak (pb ? free) 2,500 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. msrd620ctg dpak (pb ? free) 75 units/rail http://onsemi.com SSRD8620CTT4G dpak (pb ? free) 2,500 / tape & reel
msrd620ctg, msrd620ctt4g, SSRD8620CTT4G http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 200 v average rectified forward current (at rated v r , t c = 137 ? c) per leg per package i o 3.0 6.0 a peak repetitive forward current (at rated v r , square wave, 20 khz, t c = 138 ? c) per leg i frm 6.0 a non ? repetitive peak surge current (surge applied at rated load conditions, halfwave, single phase, 60 hz) per package i fsm 50 a storage / operating case temperature t stg, t c ? 55 to +175 ? c operating junction temperature t j ? 55 to +175 ? c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. thermal characteristics rating symbol value unit thermal resistance ? junction ? to ? case per leg r jc 9.0 ? c/w thermal resistance ? junction ? to ? ambient per leg r ja 80 ? c/w electrical characteristics rating symbol value unit maximum instantaneous forward voltage (note 1) (see figure 2) per leg v f t j = 25 ? c t j = 150 ? c v (i f = 3.0 a) (i f = 6.0 a) 1.15 1.35 1.05 1.30 maximum instantaneous reverse current (see figure 4) per leg i r t j = 25 ? c t j = 150 ? c a (v r = 200 v) (v r = 100 v) 5.0 2.0 200 100 maximum reverse recovery time (note 2) per leg (v r = 30 v, i f = 1.0 a, di/dt = 50 a/ s) (v r = 30 v, i f = 3.0 a, di/dt = 50 a/ s) t rr 45 55 ns maximum peak reverse recovery current per leg (v r = 30 v, i f = 1.0 a, di/dt = 50 a/ s) (v r = 30 v, i f = 3.0 a, di/dt = 50 a/ s) i rm 2.0 3.0 a 1. pulse test: pulse width ? 250 s, duty cycle ? 2%. 2. t rr measured projecting from 25% of i rm to ground.
msrd620ctg, msrd620ctt4g, SSRD8620CTT4G http://onsemi.com 3 figure 1. typical forward voltage, per leg figure 2. maximum forward voltage, per leg 1.6 0.4 v f , instantaneous forward voltage (volts) 100 10 i f , instantaneous forward current (amps) 0.1 1.0 0.6 0.8 1.2 1.4 1.8 2.0 t j = 175 ? c 25 ? c 1.0 100 ? c 150 ? c 1.6 0.4 v f , maximum instantaneous forward voltage (volts) 100 10 i f , instantaneous forward current (amps) 0.1 1.0 0.6 0.8 1.2 1.4 1.8 2.0 t j = 175 ? c 25 ? c 1.0 150 ? c figure 3. typical reverse current, per leg figure 4. maximum reverse current, per leg 100 140 0 v r , reverse voltage (volts) 100e-6 10e-6 1e-6 100e-9 10e-9 1e-9 120 i 20 40 60 80 180 160 200 , reverse current (amps) r t j = 175 ? c 150 ? c 25 ? c 100 140 0 v r , reverse voltage (volts) 100e-6 10e-6 1e-6 100e-9 10e-9 120 i 20 40 60 80 180 160 200 , maximum reverse current (amps) r t j = 175 ? c 150 ? c 25 ? c 1e-3 t c , case temperature ( ? c) 100 0.5 1.0 2.0 2.5 3.0 i f(av) 0 3.5 4.0 5.0 110 120 130 140 150 160 170 180 figure 5. current derating, case (per leg) 25 1.0 1.5 2.5 0 45 65 85 105 t a , ambient temperature ( ? c) i f(av) figure 6. current derating, ambient (per leg) rated voltage applied frequency = 20 khz r jc = 9 ? c/w t j = 175 ? c , average forward current (amps) sine wave dc , average forward current (amps) 125 145 165 185 0.5 2.0 square wave 1.5 4.5 rated voltage applied frequency = 20 khz r ja = 80 ? c/w t j = 175 ? c sine wave dc square wave
msrd620ctg, msrd620ctt4g, SSRD8620CTT4G http://onsemi.com 4 0 10 100 1.0 20 40 60 80 v r , reverse voltage (volts) figure 7. typical capacitance (per leg) c, capacitance (pf) 100 120 140 200 t j = 25 ? c 160 180 figure 8. transient thermal response (r ja ) 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 10000 t, time (s) 1.0e+00 1.0e-01 1.0e-02 1.0e-03 1.0e-04 r(t) effective transient thermal resistance (normaliz e figure 9. transient thermal response (r jc ) 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 t, time (s) 1.0e+00 1.0e-01 1.0e-02 r(t) effective transient thermal (normalized) resistance
msrd620ctg, msrd620ctt4g, SSRD8620CTT4G http://onsemi.com 5 package dimensions dpak (single gauge) case 369c ? 01 issue d b d e b3 l3 l4 b2 e m 0.005 (0.13) c c2 a c c z dim min max min max millimeters inches d 0.235 0.245 5.97 6.22 e 0.250 0.265 6.35 6.73 a 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.030 0.045 0.76 1.14 c 0.018 0.024 0.46 0.61 e 0.090 bsc 2.29 bsc b3 0.180 0.215 4.57 5.46 l4 ??? 0.040 ??? 1.01 l 0.055 0.070 1.40 1.78 l3 0.035 0.050 0.89 1.27 z 0.155 ??? 3.93 ??? notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. thermal pad contour optional within di- mensions b3, l3 and z. 4. dimensions d and e do not include mold flash, protrusions, or burrs. mold flash, protrusions, or gate burrs shall not exceed 0.006 inches per side. 5. dimensions d and e are determined at the outermost extremes of the plastic body. 6. datums a and b are determined at datum plane h. 12 3 4 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 mm inches scale 3:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h 0.370 0.410 9.40 10.41 a1 0.000 0.005 0.00 0.13 l1 0.108 ref 2.74 ref l2 0.020 bsc 0.51 bsc a1 h detail a seating plane a b c l1 l h l2 gauge plane detail a rotated 90 cw on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 msrd620ct/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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